MAU stands for Medium Attachment Unit (MaU) and is the hardware component of an FF h1 field device that establishes a direct connection between the device and the fieldbus. The MAU module SIM1-2 has been discontinued since April 2024. The discontinuation of this chipset poses challenges for many manufacturers, as transmitters and field devices in process automation often use fieldbus interfaces such as Foundation Fieldbus and PROFIBUS PA in accordance with IEC61158-2 for communication. These interfaces are often based on established chipsets such as SPC4-2 and SIM1-2 for implementing bus-powered or externally supplied devices in hazardous areas.
As a result, many field device manufacturers who still use these chipsets are currently forced to redesign their products.
Fieldbus MAU Design Package: SIM1-2 alternative for field device manufacturers
With the Fieldbus MAU Design Package, MESCO offers a proven solution. The design package replaces the SIM1-2 module with discrete electronic modules and has already been successfully integrated several times. It uses the same logical interfaces as the SIM1-2 module, but the design package is not a direct chip replacement, but a circuit design that replicates the function of the SIM1-2 1:1. The design passes the conformity tests of the fieldbus organizations and meets all Ex and EMC requirements.
Your advantages:
- Proven, robust replacement circuit for SIM1 chip solutions: Proven alternative to the SIM1-2 module
- Simple and fast redesign: MESCO offers hardware development services for an uncomplicated redesign of SIM1-based field devices
- Securing the technological solution and future-proofing: guaranteeing delivery capability and independence from the chip supplier
MESCO Design Service with implementation of redesign work:
- Hardware development service for field devices
- Schematic and layout adaptations including Ex measures
- Creation and testing of functional samples to verify the new design
- Performance of EMC and fieldbus pre-certification tests in the MESCO laboratory
- Design support: Support during the entire design process
- Documentation and Ex support: Comprehensive documentation and support for Ex requirements
For more information and support with your redesign project, please contact our MESCO team. Together we will secure the future of your field devices!
You can find out more about MESCO’s design packages in this area on the website https://mesco-engineering.com/en/design-packages/.
