PACK EXPO International 2018

14. October 2018 - 17. October 2018

Meet us at PACK EXPO in Chicago, IL

Get informed about our services in Industrial Communication, Hard & Software Development, and Functional Safety. We are also the ones to speak to when it comes to Motion Control, or Sensors.


Here´s how we can support you:

  • as an extension of your in-house engineering development team
  • when you need to get something done more quickly than can be done internally
  • if you are looking for more bandwidth to complete a project
  • if you´d like to expand your in-house expertise in some of the areas in which MESCO excels, like e.g. Functional Safety, Motion Safety, IO-Link Products/Services, Ethernet fieldbuses, Foundation Fieldbus, HART, PROFIBUS, and OPC


We look forward to meeting you.

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Technical Paper: 3D Models / 3D Printing in the Hardware Development

The use of industrial 3D printing offers the possibility of creating complex, functional geometries to support fast and agile hardware development. In addition, 3D printing makes the production of small batch sizes at economical unit costs.


The MICA platform - the solution for digital success

Efficient. Sure. Tailor-made. These are the MICA platforms MICA IO-Link and MICA Safety, which MESCO now offers for the fast cloud integration of processes. MESCO supports its customers on their way to industry 4.0.


Functional safety starts with development

The integration of the safety functions in the end devices and the exchange of safety data via the standard network bring many advantages. However, component manufacturers are increasingly confronted with development methods for functional safety, new communication protocols and high demands on hardware and software development along the way.
supports as an expert in product development to master the challenges accordingly.